PCB Depaneling Machine Operating Principle ！

1. V-Cut Depaneling Machines

• Preparation: The PCB panel is pre-machined with V-shaped grooves (typically 30°–60° angles) along the separation lines, leaving a thin remaining layer (0.1–0.3mm) to keep the panel intact during earlier manufacturing steps.
• Clamping: The panel is securely held in place by adjustable fixtures to prevent movement.
• Separation: A pneumatic or electric-driven blade/press applies controlled downward force along the V-cut lines. This force causes the remaining thin layer to bend and fracture cleanly, splitting the panel into individual PCBs.
• Key Feature: Uses minimal force to avoid stress on components, making it ideal for PCBs with components near the edges.

2. Router Depaneling Machines

• Programming: The machine is loaded with the PCB panel’s CAD design, which specifies the cutting paths (usually along "breakaway tabs"—small connecting bridges between PCBs in the panel).
• Clamping: The panel is firmly secured on a vacuum table or mechanical 夹具 to prevent vibration during cutting.
• Cutting: A spindle (rotating at 30,000–60,000 RPM) with a specialized cutter (e.g., carbide or diamond-tipped) moves along the programmed path, removing material to separate the PCBs.
• Debris Removal: An integrated vacuum system extracts dust and copper shavings to avoid contamination and protect the cutter.
• Key Feature: Offers high flexibility for complex shapes and thick PCBs but requires careful programming to avoid mechanical stress.

3. Laser Depaneling Machines

• Laser Selection: CO₂ lasers (for organic materials like FR4) or UV lasers (for precision cutting of delicate materials like FPCs or ceramics) are used based on the PCB substrate.
• Alignment: Vision systems (cameras) locate the panel’s reference marks to ensure the laser aligns with the cutting path.
• Cutting: The laser beam (focused to a diameter of 10–50μm) scans along the separation line, heating and vaporizing the material. Multiple passes may be needed for thick panels to achieve a clean cut.
• Cooling: Air or water cooling systems prevent heat damage to nearby components.
• Key Feature: No mechanical force or contact, eliminating stress, burrs, or debris—ideal for high-precision, fragile PCBs (e.g., wearables, medical devices).

4. Punch Depaneling Machines

• Die Setup: A metal die matching the PCB panel’s layout is mounted, with sharp edges corresponding to the separation lines.
• Positioning: The panel is aligned under the die using guides or vision systems.
• Stamping: A hydraulic or mechanical press drives the die downward, shearing the panel along the edges defined by the die.
• Key Feature: Extremely fast (milliseconds per panel) but limited to simple, uniform PCB shapes and low-mix production.

Core Common Principles Across All Types

• Precision Alignment: All machines use fixtures, vision systems, or reference marks to ensure cuts align with the designed separation lines.
• Minimizing Damage: Whether through controlled force (V-cut), high-speed cutting (router), non-contact energy (laser), or stamping (punch), the goal is to avoid damaging components, traces, or substrate integrity.
• Automation Integration: Most modern machines integrate with CAD software and production lines for seamless, repeatable operation.